Manta E560 γ-Glycidoxypropyl trimethoxysilane

Manta E560 is an epoxy-functional organosilane widely recognized as an industry-standard coupling agent, surface modifier, and adhesion promoter. Its dual-reactive molecular structure features a reactive glycidoxy (epoxy) group and hydrolyzable trimethoxysilyl groups. This allows it to chemically bond both inorganic substrates (glass, metals, minerals) and organic polymers (epoxies, polyurethanes, acrylics), seamlessly bridging the interfacial gap.

Unlike amino silanes, Manta E560 provides excellent non-yellowing characteristics and exceptional storage stability in reactive polymer systems.

It is the exact chemical equivalent to industry benchmarks such as Momentive Silquest A-187, Dow Z-6040, Evonik Dynasylan GLYMO, WACKER GENIOSIL GF 80, and Shin-Etsu KBM-403.

Properties

• Superior Polyurethane Stability: Offers dramatically improved shelf-life stability in single-component polyurethane (1K PU) and SPUR systems compared to traditional amino silanes, avoiding premature crosslinking or gelling.
• Non-Yellowing: Imparts excellent adhesion without the yellowing or discoloration typically associated with primary or secondary amine adhesion promoters.
• Rheology & Dispersion: Drastically lowers resin viscosity in heavily mineral-filled plastics and composites, improving filler dispersibility and enabling higher filler loading.
• Mechanical & Chemical Resistance: Significantly increases flexural strength, tensile strength, and modulus of elasticity, while markedly improving resistance to water, vapor, acids, and bases.

Manta E560 is an essential, high-performance ingredient across diverse industrial sectors:

1. Paints & Coatings: Acts as a premium additive and primer for improving wet and dry adhesion to challenging substrates, especially glass, aluminum, and steel.
2. Sealants & Adhesives: Widely used as a primer or internal additive in epoxies, polysulfides, and polyurethanes to enhance cohesive strength and substrate bonding.
3. Mineral-Filled Polymers: Ideal for the pretreatment of fillers (silica, talc, clay) and pigments, or as a direct additive to composite polymer matrices.
4. Composites & Fiberglass: Serves as a critical sizing ingredient or finish for glass fiber and glass fabric, protecting the fibers from moisture degradation.
5. Foundry Resins: Acts as a powerful additive to polyurethane and epoxy resin binders in the foundry industry.
6. Copper Clad Laminates (CCL) & Printed Circuit Boards (PCBs): Essential for the surface treatment of electronic-grade fiberglass cloth. It ensures exceptionally tight bonding between the epoxy resin matrix and copper foil, providing superior resistance to high-temperature wave soldering without delamination.
7. Epoxy Molding Compounds (EMC) / Semiconductor Packaging: A critical additive in semiconductor encapsulation materials, preventing moisture penetration and protecting delicate microchips from short circuits and environmental degradation.